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Huizhou ***BOND New Materials Co., Ltd. is a state-level high-tech enterprise, specializing in the research and development, production and marketing of high-end electronic adhesives and hydrogen energy field fuel cell adhesive and composite bipolar substrate and other new materials. The co***ny was incorporated in 2014 and incorporated into the science and Technology Enterprise Accelerator in the Petrochemical Area of Daya Bay Economic and Technological Development Zone in Huizhou. The project was funded by the linkage Science and Technology Project of Guangdong Province, and the co***ny received two rounds of investment from the local government investment fund. The co***ny mainly research and development, production of products have two parts for high-end electronic adhesive and hydrogen energy field adhesive.
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Company: |
***BOND
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Contact: |
Mr. Daifang Mo |
Address: |
No. 3, Binhai 10th Road North, Dayawan Petrochemical District, Huiyang Distric |
Postcode: |
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Tel: |
86 18107525113 |
Fax: |
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E-mail: |
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